Introduction to the Labcut 1010 Low Speed Diamond Saw

The Low Speed Diamond saw is well established in the materials laboratory for cutting and sectioning a wide variety of small and delicate samples particularly when the material structure is not homogeneous. It gives a high quality cut surface without serious deformation and with minimum burr. The universal design uses thin diamond/CBN bonded wafering blades to cut fragile and soft sample that cannot be handled by high speed abrasive/diamond cutting machines. A range of sample holders have been designed for this purpose including a rotating holder for round material. The speed of the wafering blades can be varies between 0 and 500rpm for optimum cutting conditions.

The Labcut 1010 is ruggedly constructed with a cast aluminum frame and uses stainless steel components for stability and corrosion resistance. The 1/10HP motor drives the 1/2in spindle using a toothed belt. The sample holders is held on a pivoting arm which is counterbalanced to give low loading conditions on the specimen. The arm is moved 25mm/1in with a micrometer adjustment so that the sample can be positioned for cutting. A number of weights are provided to give the required specimen loading on the rotating blade. 

Wafering Blades of 4mm/100in, 5in/125mm can be fitted on the machine. 

A wide variety of these cutting blades are available depending on application. These blades are of three types: resin bonded diamond in different concentrations, CBN bonded and abrasive blades with aluminium Oxide or silicon Carbide abrasives.

The electrics are mounted on two PCBs and include a sensor system for measuring and displaying the spindle speed 0-500rpm. A safety canopy is provided with interlock switch. The depth of cutting can be set using an adjustable electronic endpoint on the sample arm.

The cutting saw has a convenient front loading tray which can be filled with lubricant. The height of this tray is adjustable and can be locked in position so that it is at the correct height for the different sizes of wafering blades.

Specification

• Spindle: Stainless spindle 1/2in dia with flanges, Belt driven

• Blade Size: 100mm/4in, 125mm/5in or 150mm/6in diameter

• Motor: 80W/0.1HP, DC motor

• Speed Display: Speed displayed digitally on front panel. Range 0-500rpm

• Sample Holder: Counter balanced pivoting arm, variety of sample holders can be attached

• Lubricant Reservoir: Front loading tray which can be locked in position for different wheel diameters

• Dimension & Weight Size: 65mm/25.6in width x 760mm/30in depth x 1420mm/59in ht

• Weight: 18Kg/40lbs

Ordering Information 

• 8-010-001-00 Labcut 1010 Low Speed Diamond Saw 220V 50HZ
  Includes set of 3 weights, spash guard, tools and 1000-15 sample holder

• 8-010-002-00 Labcut 1010 Low Speed Diamond Saw 110V 60HZ

• 8-010-005-00 Labcut 1020 Low Speed Diamond Saw 220V 50HZ
  with smaple rotation attachment, speed controller includes set of 3 weights, splash guard, tools and 1000-15 sample holder

• 8-010-006-00 Labcut 1020 Low Speed Diamond Saw 110V 60HZ

Holders & Attachments

6-010-015-00 Irregular Sample Holder 6-010-020-00 V-block holder (small) 6-010-022-00 V-block holder (large) 6-010-024-00 Double V-block holder 6-010-025-00 Cylindrical mount 1in/25mm 6-010-026-00 Cylindrical mount 11/4 in 32mm 6-010-028-00 Ceramic disc holder w/ 3 discs 6-010-030-00 Mounting plate 38x25mm 1.5 x 1in

6-010-031-00 Mounting Plate 38mm/11/2 in dia 6-010-032-00 Mounting Plate 25mm/1 in dia 6-010-034-00 Mounting stubs 19mm dia pk/5 6-010-036-00 PCB Holder 6-010-038-00 Tilting holder 6-010-040-00 Vacuum holder 6-010-041-00 A Vacuum pump 6-010-100-00 sample rotation attachment incl power supply